Copper clad laminates are commonly used in pcb manufacturer process as follows:
FR-1 -- phenolic cotton paper, the base material is commonly known as electric board (higher economic efficiency than FR-2)
FR-2 -- phenolic cotton paper
Fr-3 - cotton paper, epoxy resin
FR-4 - Woven glass, epoxy resin
FR-5 -- glass cloth, epoxy resin
Fr-6 -- ground glass, polyester
G-10 - Woven glass, epoxy resin
CEM-1 -- cotton paper, epoxy resin (flame retardant)
Cem-2 -- cotton paper, epoxy resin (non flame retardant)
CEM-3 -- Woven glass, epoxy resin
Cem-4 -- Woven glass, epoxy resin
Cem-5 -- Woven glass, polyesters
Ain -- aluminum nitride
SiC -- silicon carbide